Inside Huawei AI Chip Integration Plan | AI Guts

Imagine connecting hundreds of powerful AI chips scattered in dozens of server shelves and making them work collectively as though they were a single, massive pc. That is exactly what Huawei tested at HUAWEI CONNECT 2025, where the agency unveiled a step forward in AI infrastructure structure that would reshape how the sector builds and scales synthetic intelligence structures.

Inside Huawei AI Chip Integration Plan, instead of traditional approaches in which individual servers operate truly independently, Huawei’s new SuperPoD technology creates what the enterprise’s executives describe as a single logical system made from many separate processing devices, allowing them to learn, think, and reason as one.

The implications extend beyond astonishing technical specs, representing a shift in how AI computing strength may be organised, scaled, and deployed in industries.

UnifiedBus 2.0: The Technical Foundation for Smarter Systems

At the core of Huawei’s infrastructure method is UnifiedBus (UB). Yang Chaobin, Huawei’s Director of the Board and CEO of the ICT Business Group, defined that “Huawei has developed the groundbreaking SuperPoD structure based on our UnifiedBus interconnect protocol. The structure deeply interconnects bodily servers with a view to examining, thinking, and reasoning like a single logical server.”

The technical specs monitor the scope of this achievement. The UnifiedBus protocol addresses  demanding situations that, historically, have limited big-scale AI computing: the reliability of lengthy-variety communications and bandwidth-latency. Traditional copper connections offer high bandwidth, however, only over brief distances, typically connecting possibly shelves.

Optical cables support a longer variety but suffer from reliability troubles that become extra complex the larger the gap and scale. Eric Xu, Huawei’s Deputy Chairman and Rotating Chairman, said that solving those essential connectivity-demanding situations became vital to the enterprise’s AI infrastructure method.

Xu specializes the leap leap-forward solutions in terms of the OSI model: “We have built reliability into each layer of our interconnect protocol, from the physical layer and data link layer, all the way up to the network and transmission layers. There is one hundred-ns-stage fault detection and safety switching on optical paths, making any intermittent disconnections or faults of optical modules imperceptible at the software layer.”

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SuperPoD Architecture: Unlocking Scale and Performance Efficiency

The Atlas 950 SuperPoD represents the flagship implementation of this architecture, comprising up to 8,192 Ascend 950DT chips in a configuration that Xu described as turning in “8 EFLOPS in FP8 and 16 EFLOPS in FP4. Its interconnect bandwidth could be sixteen PB/s. This method shows that a single Atlas 950 SuperPoD can have an interconnect bandwidth over 10 times better than the complete globe’s overall height net bandwidth.”

The specs are more than incremental enhancements. The Atlas 950 SuperPoD occupies a hundred and sixty shelves in 1,000m2, with 128 compute cabinets and 32 comms shelves related to all-optical interconnects. The gadget’s memory ability reaches 1,152 TB and keeps what Huawei claims is 2.1-microsecond latency within the whole machine.

Later inside the manufacturing pipeline might be the Atlas 960 SuperPoD, which is about to contain 15,488 Ascend 960 chips in 220 cabinets protecting 2,200m2. Xu said it’s going to deliver “30 EFLOPS in FP8 and 60 EFLOPS in FP4, and include four,460 TB of reminiscence and 34 PB/s interconnect bandwidth.”

Beyond AI: Expanding into General-Purpose Computing

The SuperPoD idea extends beyond AI workloads into fashionable-cause computing through the TaiShan 950 SuperPoD. Built on Kunpeng 950 processors, this gadget addresses organizational demanding situations in changing legacy mainframes and mid-range computer systems.

Xu placed this as specifically applicable for the finance region, where “the TaiShan 950 SuperPoD, combined with the dispensed GaussDB, can serve as an excellent alternative, and replace — as soon as and for all — mainframes, mid-variety computers, and Oracle’s Exadata database servers.”

Open Architecture Strategy: Building Flexible Systems

Perhaps most importantly for the broader AI infrastructure marketplace, Huawei announced the release of UnifiedBus 2.0 technical specs as open requirements. The choice displays each strategic positioning and practical constraints.

Xu mentioned that “the Chinese mainland will lag at the back of in semiconductor manufacturing technique nodes for the long term” and emphasised that “sustainable computing energy can handiest be executed with technique nodes which can be almost available.”

Yang framed the open approach as atmosphere building: “We are dedicated to our open-hardware and open-source-software program approach so as to help greater partners increase their own industry-state of affairs-primarily based SuperPoD solutions. This will boost developer innovation and foster a thriving environment.”

The corporation is to open-supply hardware and software components, with hardware consisting of NPU modules, air-cooled and liquid-cooled blade servers, AI playing cards, CPU forums, and cascade playing cards. For software, Huawei is devoted to absolutely open-sourcing CANN compiler tools, Mind series application kits, and openPangu basis models with the aid of 31 December 2025.

The Role of Market Deployment in Shaping Ecosystem Impact

Real-world deployment presents validation for those technical claims. Over 300 Atlas 900 A3 SuperPoD units have already been shipped in 2025, which have been deployed for more than 20 customers from more than one sector, including the Internet, finance, carrier, power, and manufacturing sectors.

The implications for the development of China’s AI infrastructure are extensive. By creating an open surroundings round home generation, Huawei is addressing the demanding situations of building competitive AI infrastructure, internal parameters set by restrained semiconductor production and availability. Its method enables broader industry participation in growing AI infrastructure solutions while not having get right of entry to to the most advanced procedure nodes.

For the worldwide AI infrastructure market, Huawei’s open architecture approach introduces an opportunity to the tightly included, proprietary hardware and software method dominant among Western competition. Whether the ecosystem proposed with the aid of Huawei can acquire similar performance and hold commercial viability remains to be confirmed at scale.

Ultimately, the SuperPoD structure represents a greater than incremental enhancement for AI computing. Huawei is providing a fundamental understanding of the way large computational assets are linked, managed, and scaled. The open-supply release of its specifications and factors will take a look at whether or not collaborative improvement can accelerate AI infrastructure innovation in an environment of partners. That has the ability to reshape competitive dynamics in the worldwide AI infrastructure market.